Tougo Teramoto

Inventor

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Work History

Patent OwnerApplications FiledYear
KONICA MINOLTA ADVANCED LAYERS, INC.
2
2
2010
2011
KONICA MINOLTA HOLDINGS, INC.
2
2003
KONICA MINOLTA PHOTO IMAGING, INC.
2
11
2004
2005
KONICA MINOLTA OPTO, INC.
8
1
4
2006
2009
2010
Minolta Co., Ltd.
3
1
4
1
2
1
1996
1997
1998
1999
2001
2002
Minolta Camera Kabushiki Kaisha
1
1
2
1
1
1978
1979
1990
1991
1995

Inventor Addresses

AddressDuration
Hino, JPMay 12, 09 - May 12, 09
Osaka, JPAug 12, 97 - Aug 12, 97
Tokyo, JPJan 25, 07 - Aug 19, 10
WAKAYAMA-SHI, JPAug 16, 01 - Oct 14, 04
Wakayama, JPMar 03, 81 - Jan 06, 15
Wakayama-Shi, JPFeb 21, 02 - Apr 24, 03
Wakayama-shi, JPDec 30, 04 - Feb 14, 13

Technology Profile

Technology Matters
B23P: OTHER WORKING OF METAL; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS 1
B26D: CUTTING; DETAILS COMMON TO MACHINES FOR SEVERING, e.g. BY CUTTING, PERFORATING, PUNCHING, STAMPING-OUT 1
B28B: SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS, SLAG OR MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER 1

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Patents / Publication

Patents / Publication #Year of Publication / IssuedTitleCitations
89289822015Wafer lens, laminated wafer lens, wafer lens cutting method and laminated wafer lens cutting method0
87920442014Image pickup device and method for manufacturing the image pickup device4
87921802014Production method of wafer lens, intermediate die, optical component, molding die, and production method of molding die1
2013/0038,9522013Wafer Lens, Laminated Wafer Lens, Wafer Lens Cutting Method and Laminated Wafer Lens Cutting Method1
2012/0218,4552012Image Pickup Device and Method for Manufacturing the Image Pickup Device32

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