Masato Takayama
Inventor
Stats
- 6 US patents issued
- 17 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 6 US Patents Issued
- 17 US Applications Filed
- 79 Total Citation Count
- Jan 26, 2024 Most Recent Filing
- Dec 20, 1990 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| SONY CORPORATION | 1
1 | 1990
1995 |
| Secom Corporation Limited | 1
| 1995
|
| JAPAN POLYPROPYLENE CORPORATION | 2
2 | 2013
2016 |
| TOKYO ELECTRON LIMITED | 1
| 2016
|
| SECOMA CORPORATION LIMITED | 1
| 1995
|
Inventor Addresses
| Address | Duration |
|---|---|
| Kanagawa, JP | Nov 10, 92 - Aug 20, 96 |
| Kurokawa-gun, JP | Oct 13, 16 - Oct 13, 16 |
| Mie, JP | Nov 12, 15 - Mar 21, 17 |
| Miyagi, JP | Aug 06, 19 - May 16, 24 |
| Tokyo, JP | Jan 28, 21 - Feb 11, 25 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| A23K: | FODDER | 1 |
| A61K: | PREPARATIONS FOR MEDICAL, DENTAL, OR TOILET PURPOSES | 1 |
| B32B: | LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM | 3 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 12221496 | 2025 | Fibrillated chemically modified cellulose fiber | 0 |
| 2024/0162,075 | 2024 | SUBSTRATE SUPPORT AND SUBSTRATE PROCESSING DEVICE | 0 |
| 11894218 | 2024 | Electrostatic chuck, support platform, and plasma processing apparatus | 0 |
| D1012051 | 2024 | Electrostatic chuck for semiconductor manufacturing device | 0 |
| 2023/0268,217 | 2023 | ELECTROSTATIC CHUCK MANUFACTURING METHOD, ELECTROSTATIC CHUCK, AND SUBSTRATE PROCESSING APPARATUS | 0 |
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