Chih-Hsuan Tai
Inventor
Stats
- 2 US patents issued
- 58 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 2 US Patents Issued
- 58 US Applications Filed
- 172 Total Citation Count
- Jul 30, 2024 Most Recent Filing
- Jul 1, 2016 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. | 3
| 2016
|
| JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED | 2
| 2016
|
Inventor Addresses
| Address | Duration |
|---|---|
| Hsin-Chu, TW | Aug 10, 17 - Feb 27, 18 |
| Hsinchu, TW | Jun 27, 17 - Nov 21, 24 |
| TAIPEI CITY, TW | May 23, 24 - Aug 15, 24 |
| Taipei City, TW | Jun 28, 18 - Nov 07, 24 |
| Taipei, TW | Dec 18, 18 - Feb 11, 25 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| G02B: | OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS | 5 |
| G06F: | ELECTRIC DIGITAL DATA PROCESSING | 4 |
| G06K: | RECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS | 8 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 12222545 | 2025 | Package and method of forming same | 0 |
| 12205860 | 2025 | Sensor packages | 0 |
| 2024/0385,370 | 2024 | PACKAGE AND METHOD OF FORMING SAME | 0 |
| 2024/0387,411 | 2024 | DELAMINATION SENSOR | 0 |
| 2024/0371,814 | 2024 | PACKAGE STRUCTURE | 0 |
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