Chia-Hsin TAI
Inventor
Stats
- 1 US patents issued
- 1 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 1 US Patents Issued
- 1 US Applications Filed
- 0 Total Citation Count
- Jul 29, 2016 Most Recent Filing
- Jul 29, 2016 Earliest Filing
Work History
Patent Owner | Applications Filed | Year |
---|---|---|
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. | 1
| 2016
|
Inventor Addresses
Address | Duration |
---|---|
Tainan City, TW | Feb 01, 18 - Feb 01, 18 |
Tainan, TW | May 15, 18 - May 15, 18 |
Technology Profile
Technology | Matters | |
---|---|---|
H01L: | SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | 1 |
Patents / Publication
Patents / Publication # | Year of Publication / Issued | Title | Citations |
---|---|---|---|
9972526 | 2018 | Method for forming conductive structure in semiconductor structure | 0 |
2018/0033,686 | 2018 | METHOD FOR FORMING CONDUCTIVE STRUCTURE IN SEMICONDUCTOR STRUCTURE | 0 |
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