Huang-Wen Tseng
Inventor
Stats
- 0 US patents issued
- 33 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 0 US Patents Issued
- 33 US Applications Filed
- 97 Total Citation Count
- Nov 22, 2024 Most Recent Filing
- Jul 18, 2011 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. | 1
1 | 2011
2015 |
Inventor Addresses
| Address | Duration |
|---|---|
| HSINCHU COUNTY, TW | Mar 05, 20 - Feb 08, 24 |
| Hsinchu County, TW | Jun 07, 18 - Dec 26, 23 |
| Hsinchu, TW | May 16, 19 - Mar 13, 25 |
| Zhubei City, TW | Jan 24, 13 - Sep 19, 24 |
| Zhubei, TW | Dec 11, 18 - Dec 31, 24 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| A61K: | PREPARATIONS FOR MEDICAL, DENTAL, OR TOILET PURPOSES | 2 |
| A61Q: | USE OF COSMETICS OR SIMILAR TOILET PREPARATIONS | 2 |
| B81B: | MICRO-STRUCTURAL DEVICES OR SYSTEMS, e.g. MICRO-MECHANICAL DEVICES | 3 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 2025/0087,553 | 2025 | SEMICONDUCTOR DEVICE WITH ENHANCED THERMAL DISSIPATION AND METHOD FOR MAKING THE SAME | 0 |
| 12183655 | 2024 | Semiconductor device with enhanced thermal dissipation and method for making the same | 0 |
| 2024/0312,851 | 2024 | SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME | 0 |
| 2024/0262,681 | 2024 | DUAL MICRO-ELECTRO MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF | 0 |
| 12027433 | 2024 | Semiconductor package and method for making the same | 0 |
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