Wang-Hsiang Tsai
Inventor
Stats
- 1 US patents issued
- 7 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 1 US Patents Issued
- 7 US Applications Filed
- 73 Total Citation Count
- Jul 5, 2021 Most Recent Filing
- Oct 25, 2007 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| PHOENIX PRECISION TECHNOLOGY CORPORATION | 1
| 2007
|
| UNIMICRON TECHNOLOGY CORP. | 2
1 1 | 2007
2016 2017 |
Inventor Addresses
| Address | Duration |
|---|---|
| Hsin-feng, TW | - |
| Hsinchu, TW | Jun 28, 11 - Jun 28, 11 |
| Taoyuan City, TW | Apr 20, 17 - Jul 21, 22 |
| Taoyuan, TW | Sep 21, 21 - Feb 06, 24 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| H01L: | SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | 6 |
| H05K: | PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS | 6 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 11895780 | 2024 | Manufacturing method of package structure | 0 |
| 11477886 | 2022 | Circuit board structure and spliced circuit board | 0 |
| 2022/0232,702 | 2022 | CIRCUIT BOARD STRUCTURE AND SPLICED CIRCUIT BOARD | 0 |
| 11127664 | 2021 | Circuit board and manufacturing method thereof | 0 |
| 2021/0195,761 | 2021 | MANUFACTURING METHOD OF PACKAGE STRUCTURE | 0 |
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