Yan Dong SUN

Inventor

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Work History

Patent OwnerApplications FiledYear
ASM TECHNOLOGY SINGAPORE PTE LTD
2
2015

Inventor Addresses

AddressDuration
Singapore, SGJan 28, 16 - May 02, 17

Technology Profile

Technology Matters
B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 1
H01L: SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 1

Patents / Publication

Patents / Publication #Year of Publication / IssuedTitleCitations
96405122017Wire bonding apparatus comprising an oscillator mechanism3
2016/0023,2982016WIRE BONDING APPARATUS COMPRISING AN OSCILLATOR MECHANISM4

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