Nicholas Stevens-Yu
Inventor
Stats
- 0 US patents issued
- 2 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 0 US Patents Issued
- 2 US Applications Filed
- 13 Total Citation Count
- Apr 12, 2024 Most Recent Filing
- May 28, 2021 Earliest Filing
Work History
No Work History Available.Inventor Addresses
| Address | Duration |
|---|---|
| Palo Alto, CA, US | Dec 02, 21 - Mar 04, 25 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B23K: | SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM | 1 |
| H01L: | SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | 2 |
| H05K: | PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS | 2 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 12243802 | 2025 | Methods and heat distribution devices for thermal management of chip assemblies | 0 |
| 2024/0347,414 | 2024 | Methods And Heat Distribution Devices For Thermal Management Of Chip Assemblies | 0 |
| 11990386 | 2024 | Methods and heat distribution devices for thermal management of chip assemblies | 0 |
| 2021/0378,106 | 2021 | Methods And Heat Distribution Devices For Thermal Management Of Chip Assemblies | 11 |
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