Edith Stenhäuser
Inventor
Stats
- 0 US patents issued
- 1 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 0 US Patents Issued
- 1 US Applications Filed
- 5 Total Citation Count
- Oct 1, 2012 Most Recent Filing
- Oct 1, 2012 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| ATOTECH DEUTSCHLAND GMBH | 1
| 2012
|
Inventor Addresses
| Address | Duration |
|---|---|
| Berlin, DE | Aug 28, 14 - Aug 28, 14 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| C23C: | COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 2014/0242,264 | 2014 | FORMALDEHYDE-FREE ELECTROLESS COPPER PLATING SOLUTION | 5 |
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