Thomas S Smith, II
Inventor
Stats
- 5 US patents issued
- 9 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 5 US Patents Issued
- 9 US Applications Filed
- 32 Total Citation Count
- Sep 22, 2021 Most Recent Filing
- Aug 22, 2008 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| HENKEL CORPORATION | 1
| 2008
|
| HENKEL AG & CO. KGAA | 2
6 2 | 2008
2009 2014 |
Inventor Addresses
| Address | Duration |
|---|---|
| Novi, MI, US | Feb 05, 09 - Nov 12, 24 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B05D: | PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL | 3 |
| B32B: | LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM | 2 |
| C08F: | MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS | 3 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 12139635 | 2024 | Coatings for waterproofing electronic components | 0 |
| 12110413 | 2024 | Coatings for waterproofing electronic components | 0 |
| 11535940 | 2022 | Use of an adhesion promoter obtainable as a reaction product of a di- or poly amine with α,β-unsaturated carboxylic acid derivatives for metal surface treatment | 0 |
| 2022/0002,559 | 2022 | COATINGS FOR WATERPROOFING ELECTRONIC COMPONENTS | 0 |
| 2021/0309,880 | 2021 | DIRECT TO SUBSTRATE COATING VIA IN SITU POLYMERIZATION | 0 |
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