Eva E Simonyi
Inventor
Stats
- 6 US patents issued
- 7 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 6 US Patents Issued
- 7 US Applications Filed
- 403 Total Citation Count
- Mar 24, 2008 Most Recent Filing
- Oct 30, 1987 Earliest Filing
Work History
Patent Owner | Applications Filed | Year |
---|---|---|
IBM INFORMATION PRODUCTS CORPORATION, 55 RAILROAD AVENUE, GREENWICH, CT 06830 A CORP OF DE | 1
| 1987
|
INTERNATIONAL BUSINESS MACHINES CORPORATION | 1
1 1 | 1990
1994 1997 |
GLOBALFOUNDRIES INC. | 1
1 2 | 1998
2005 2008 |
FOOTWEAR ACQUISITION, INC. | 1
| 1990
|
Inventor Addresses
Address | Duration |
---|---|
Bronx, NY | Mar 07, 89 - Sep 05, 00 |
Bronx, NY, US | Apr 20, 06 - Nov 30, 10 |
Technology Profile
Technology | Matters | |
---|---|---|
B05D: | PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL | 1 |
B32B: | LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM | 2 |
B41J: | TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS | 1 |
Patents / Publication
Patents / Publication # | Year of Publication / Issued | Title | Citations |
---|---|---|---|
7843067 | 2010 | Method and structure of integrated rhodium contacts with copper interconnects | 1 |
2009/0239,062 | 2009 | METHOD AND STRUCTURE OF INTEGRATED RHODIUM CONTACTS WITH COPPER INTERCONNECTS | 4 |
2006/0084,282 | 2006 | Porous organosilicates with improved mechanical properties | 4 |
6114413 | 2000 | Thermally conducting materials and applications for microelectronic packaging | 72 |
5898991 | 1999 | Methods of fabrication of coaxial vias and magnetic devices | 165 |
We are sorry but your current selection exceeds the maximum number of portfolios (0) for this membership level.
>
Upgrade to our Level for up to -1 portfolios!.