Feng-Jia Shiu
Inventor
Stats
- 17 US patents issued
- 62 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 17 US Patents Issued
- 62 US Applications Filed
- 413 Total Citation Count
- Nov 7, 2024 Most Recent Filing
- Sep 5, 2003 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. | 1
1 2 2 7 1 4 7 4 2 4 | 2003
2004 2005 2006 2007 2008 2009 2011 2013 2014 2016 |
Inventor Addresses
| Address | Duration |
|---|---|
| Hsin-Chu City, TW | Oct 18, 07 - Oct 18, 07 |
| Hsin-Chu, TW | Aug 19, 14 - Aug 19, 14 |
| Hsinchu CIty, TW | Sep 26, 13 - Sep 26, 13 |
| Hsinchu City, TW | Jul 21, 05 - Jun 30, 11 |
| Hsinchu County, TW | Jul 03, 14 - Nov 14, 24 |
| Hsinchu, TW | Apr 19, 05 - Feb 27, 25 |
| Jhudong Township, Hsinchu County, TW | May 15, 12 - May 15, 12 |
| Jhudong Township, TW | Apr 02, 09 - Dec 05, 24 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B05C: | APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL | 1 |
| B44C: | PRODUCING DECORATIVE EFFECTS | 1 |
| C23F: | NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACES | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 2025/0069,881 | 2025 | METHOD FOR REDUCING CHARGING OF SEMICONDUCTOR WAFERS | 0 |
| 12165867 | 2024 | Method for reducing charging of semiconductor wafers | 0 |
| 2024/0404,877 | 2024 | METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE | 0 |
| 2024/0379,357 | 2024 | IMPLANTATION MASK FORMATION | 0 |
| 2024/0334,847 | 2024 | VIA STRUCTURE AND METHODS OF FORMING THE SAME | 0 |
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