Hiroshi Shindo
Inventor
Stats
- 12 US patents issued
- 12 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 12 US Patents Issued
- 12 US Applications Filed
- 87 Total Citation Count
- Sep 14, 2016 Most Recent Filing
- Jun 15, 1981 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| TDK CORPORATION | 1
4 2 2 2 2 4 | 1997
2001 2002 2004 2006 2010 2016 |
| Pioneer Electronic Corporation | 2
| 1981
|
Inventor Addresses
| Address | Duration |
|---|---|
| Kisakata-machi, JP | Apr 27, 99 - Apr 27, 99 |
| Tokyo, JP | Sep 20, 83 - May 22, 18 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B23K: | SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM | 1 |
| B23P: | OTHER WORKING OF METAL; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS | 2 |
| B24B: | MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING | 2 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 9978521 | 2018 | Multilayer electronic component | 1 |
| 9972440 | 2018 | Multilayer electronic component | 1 |
| 9870866 | 2018 | Multilayer electronic component | 2 |
| 2017/0076,870 | 2017 | MULTILAYER ELECTRONIC COMPONENT | 13 |
| 2017/0076,864 | 2017 | MULTILAYER ELECTRONIC COMPONENT | 7 |
We are sorry but your current selection exceeds the maximum number of portfolios (0) for this membership level.
>
Upgrade to our Level for up to -1 portfolios!.