NARAE SHIN
Inventor
Stats
- 1 US patents issued
- 11 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 1 US Patents Issued
- 11 US Applications Filed
- 7 Total Citation Count
- Aug 27, 2024 Most Recent Filing
- Apr 25, 2014 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| SAMSUNG ELECTRONICS CO., LTD. | 3
| 2014
|
Inventor Addresses
| Address | Duration |
|---|---|
| Suwon-si, Gyeonggi-do, KR | Mar 13, 25 - Mar 13, 25 |
| Suwon-si, KR | Nov 16, 23 - Feb 20, 25 |
| Yongin-si, KR | Nov 06, 14 - Apr 12, 16 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| G09G: | ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION | 1 |
| H01L: | SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | 10 |
| H05B: | ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 2025/0087,562 | 2025 | CHIP ON FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME | 0 |
| 2025/0062,211 | 2025 | DRIVING CIRCUIT MOUNTING FILM | 0 |
| 2024/0413,071 | 2024 | SEMICONDUCTOR PACKAGE AND PACKAGE MODULE INCLUDING THE SAME | 0 |
| 2024/0321,712 | 2024 | CHIP-ON-FILM PACKAGE | 0 |
| 2024/0321,902 | 2024 | CHIP-ON-FILM PACKAGE AND MANUFACTURING METHOD THEREOF | 0 |
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