Toshihisa Shimo
Inventor
Stats
- 26 US patents issued
- 47 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 26 US Patents Issued
- 47 US Applications Filed
- 272 Total Citation Count
- Jul 13, 2017 Most Recent Filing
- Feb 2, 2001 Earliest Filing
Work History
Inventor Addresses
| Address | Duration |
|---|---|
| Aichi, JP | Mar 25, 10 - Dec 29, 11 |
| Aichi-Ken, JP | Mar 11, 10 - Mar 11, 10 |
| Aichi-ken, JP | Sep 27, 07 - Feb 25, 10 |
| Aiohi, JP | Feb 25, 10 - Feb 25, 10 |
| Kariya, JP | Jul 08, 03 - Jun 09, 20 |
| Kariya-shi, JP | Sep 27, 01 - Jan 02, 20 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| A61B: | DIAGNOSIS; SURGERY; IDENTIFICATION | 1 |
| B05D: | PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL | 9 |
| B23K: | SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 10680068 | 2020 | Semiconductor substrate | 1 |
| 2020/0006,493 | 2020 | SEMICONDUCTOR SUBSTRATE | 0 |
| 8940808 | 2015 | Curable coating agent composition | 1 |
| 8900712 | 2014 | Member for vehicle and manufacturing process for the same | 1 |
| 8784638 | 2014 | Resin board to be subjected to ozone treatment, wiring board, and method of manufacturing the wiring board | 0 |
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