Che Chi Shih
Inventor
Stats
- 0 US patents issued
- 12 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 0 US Patents Issued
- 12 US Applications Filed
- 0 Total Citation Count
- Jul 8, 2024 Most Recent Filing
- Nov 23, 2021 Earliest Filing
Work History
No Work History Available.Inventor Addresses
| Address | Duration |
|---|---|
| Bolingbrook, IL, US | Oct 05, 23 - Oct 05, 23 |
| Hsinchu City, TW | Jan 19, 23 - Jan 19, 23 |
| Hsinchu, TW | Aug 13, 24 - Oct 31, 24 |
| Taoyuan City, TW | Sep 19, 24 - Apr 10, 25 |
| Taoyuan, TW | Aug 15, 24 - Oct 29, 24 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| H01L: | SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | 12 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 2025/0118,619 | 2025 | THERMAL CONDUCTIVE BONDING STRUCTURE | 0 |
| 2025/0031,413 | 2025 | SEMICONDUCTOR DEVICE AND METHOD FOR THERMAL DISSIPATION | 0 |
| 2025/0006,561 | 2025 | STACKED MULTI-GATE DEVICE WITH REDUCED CONTACT RESISTANCE AND METHODS FOR FORMING THE SAME | 0 |
| 2024/0413,039 | 2024 | HEAT SINK FOR STACKED MULTI-GATE DEVICE | 0 |
| 2024/0363,421 | 2024 | Semiconductor Devices With A Rare Earth Metal Oxide Layer | 0 |
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