Sigemasa Segawa
Inventor
Stats
- 5 US patents issued
- 6 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 5 US Patents Issued
- 6 US Applications Filed
- 37 Total Citation Count
- Feb 25, 2011 Most Recent Filing
- Aug 1, 2003 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| PI R&D CO., LTD (20%) | 2
| 2003
|
| NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY (80%) | 2
| 2003
|
| NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY | 2
2 | 2003
2005 |
| MITSUBISHI ELECTRIC CORPORATION | 2
| 2011
|
| PI R&D CO., LTD. | 2
2 1 2 3 | 2003
2005 2007 2010 2011 |
Inventor Addresses
| Address | Duration |
|---|---|
| Kanagawa, JP | Jul 23, 09 - Apr 26, 12 |
| Yokohama, JP | Jun 28, 05 - Mar 24, 15 |
| Yokohama-shi, JP | Mar 25, 04 - Sep 01, 11 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| C08G: | MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS | 3 |
| C08L: | COMPOSITIONS OF MACROMOLECULAR COMPOUNDS | 2 |
| C09D: | COATING COMPOSITIONS, e.g. PAINTS, VARNISHES, LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 8987376 | 2015 | Polyimide resin composition for semiconductor devices, method of forming film in semiconductor devices using the same and semiconductor devices | 0 |
| 8859170 | 2014 | Photosensitive modified polyimide resin composition and use thereof | 1 |
| 8349537 | 2013 | Photosensitive ink composition for screen printing and method of forming positive relief pattern with use thereof | 1 |
| 2012/0097,435 | 2012 | PHOTOSENSITIVE MODIFIED POLYIMIDE RESIN COMPOSITION AND USE THEREOF | 9 |
| 2011/0213,075 | 2011 | POLYIMIDE RESIN COMPOSITION FOR SEMICONDUCTOR DEVICES, METHOD OF FORMING FILM IN SEMICONDUCTOR DEVICES USING THE SAME AND SEMICONDUCTOR DEVICES | 6 |
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