Fernando A Santos
Inventor
Stats
- 13 US patents issued
- 33 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 13 US Patents Issued
- 33 US Applications Filed
- 165 Total Citation Count
- Dec 19, 2022 Most Recent Filing
- Dec 15, 2011 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| NXP USA, INC. | 2
4 4 11 2 4 | 2011
2012 2013 2014 2015 2016 |
Inventor Addresses
| Address | Duration |
|---|---|
| AUSTIN, TX, US | Mar 24, 16 - Mar 24, 16 |
| Austin, TX, US | May 10, 16 - May 10, 16 |
| CHANDLER, AZ, US | Jun 18, 15 - Apr 11, 19 |
| Chandler, AZ, US | Jun 20, 13 - Dec 31, 24 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| H01L: | SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | 31 |
| H03F: | AMPLIFIERS | 10 |
| H03H: | IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS | 2 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 12184237 | 2024 | Surface-mount amplifier devices | 0 |
| 12040291 | 2024 | Radio frequency packages containing multilevel power substrates and associated fabrication methods | 0 |
| 2024/0203,912 | 2024 | AMPLIFIER MODULES AND SYSTEMS WITH GROUND TERMINALS ADJACENT TO POWER AMPLIFIER DIE | 0 |
| 11984429 | 2024 | Leadless power amplifier packages including topside termination interposer arrangements and methods for the fabrication thereof | 0 |
| 2023/0197,645 | 2023 | RADIO FREQUENCY PACKAGES CONTAINING MULTILEVEL POWER SUBSTRATES AND ASSOCIATED FABRICATION METHODS | 0 |
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