Yasuhisa Sano
Inventor
Stats
- 8 US patents issued
- 15 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 8 US Patents Issued
- 15 US Applications Filed
- 106 Total Citation Count
- Apr 1, 2019 Most Recent Filing
- Oct 9, 1984 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| FUJI PHOTO FILM CO., LTD. | 1
| 1984
|
| Toho Engineering Co., Ltd. | 1
| 2015
|
| OSAKA UNIVERSITY | 4
1 | 2010
2015 |
| EBARA CORPORATION | 1
2 2 1 4 1 1 | 2006
2007 2008 2009 2010 2012 2014 |
| FUJIFILM CORPORATION | 3
| 2008
|
Inventor Addresses
| Address | Duration |
|---|---|
| Minami-ashigara, JP | Feb 21, 12 - Feb 21, 12 |
| Minami-ashigara-shi, JP | Oct 02, 08 - Oct 02, 08 |
| Osaka, JP | Mar 27, 08 - Feb 09, 21 |
| Osaka-fu, JP | Aug 17, 10 - Mar 25, 14 |
| Shizuoka, JP | Aug 19, 86 - Aug 19, 86 |
| Suita, JP | Dec 25, 18 - Dec 25, 18 |
| Suita-shi, JP | Mar 09, 17 - Mar 09, 17 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B24B: | MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING | 4 |
| B32B: | LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM | 1 |
| B41M: | PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 10916455 | 2021 | Flattening method and flattening apparatus | 0 |
| 2019/0228,994 | 2019 | FLATTENING METHOD AND FLATTENING APPARATUS | 0 |
| 10297475 | 2019 | Flattening method and flattening apparatus | 3 |
| 10163645 | 2018 | Method for processing wide-bandgap semiconductor substrate and apparatus therefor | 0 |
| 2017/0069,506 | 2017 | METHOD FOR PROCESSING WIDE-BANDGAP SEMICONDUCTOR SUBSTRATE AND APPARATUS THEREFOR | 3 |
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