Audel A Sanchez

Inventor

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Work History

Patent OwnerApplications FiledYear
NXP USA, INC.
2
2
2
4
4
12
2
3
2004
2010
2011
2012
2013
2014
2015
2016

Inventor Addresses

AddressDuration
TEMPE, AZ, USSep 11, 14 - May 26, 16
Tempe, AZSep 05, 06 - Sep 05, 06
Tempe, AZ, USJan 19, 06 - Aug 06, 19

Technology Profile

Technology Matters
B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM 1
H01L: SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 17
H03F: AMPLIFIERS 2

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Patents / Publication

Patents / Publication #Year of Publication / IssuedTitleCitations
103758332019Methods of manufacturing packaged electronic devices with top terminations2
2018/0270,9602018PACKAGED ELECTRONIC DEVICES WITH TOP TERMINATIONS, AND METHODS OF MANUFACTURE THEREOF3
99866462018Packaged electronic devices with top terminations, and methods of manufacture thereof5
98002082017Radio frequency devices with surface-mountable capacitors for decoupling and methods thereof0
96468972017Die crack detector with integrated one-time programmable element3

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