Hiroshi Sagane

Inventor

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Work History

Patent OwnerApplications FiledYear
Daicel-Huels Ltd.
1
1997
DAICEL POLYMER LTD.
2
2
2004
2005
Daicel Chemical Industries, Ltd.
1
1
2
1
1
1995
1996
1997
2000
2001
TECHNO POLYMER CO., LTD.
1
1997

Inventor Addresses

AddressDuration
Hyogo, JPFeb 10, 05 - Sep 18, 07
Osaka, JPJun 29, 99 - Oct 31, 06
Osaka-fu, JPMar 18, 97 - Jan 27, 98
Sakai, JPJul 13, 99 - Jul 01, 03

Technology Profile

Technology Matters
B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 1
B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM 1
C08F: MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS 2

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Patents / Publication

Patents / Publication #Year of Publication / IssuedTitleCitations
72712122007Thermoplastic resin composition and shaped article12
71294392006Resin molded body joining method2
2005/0279,7382005Resin molded body joining method2
2005/0032,9612005Thermoplastic resin composition and shaped article8
65865182003Resin composition capable of laser marking method, and marked molded article3

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