Mariam Sadaka
Inventor
Stats
- 36 US patents issued
- 46 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 36 US Patents Issued
- 46 US Applications Filed
- 919 Total Citation Count
- Sep 25, 2020 Most Recent Filing
- Nov 17, 2005 Earliest Filing
Work History
Patent Owner | Applications Filed | Year |
---|---|---|
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. | 2
| 2005
|
COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES | 2
| 2011
|
FLEXTRONICS INTERNATIONAL USA, INC. | 1
| 2008
|
FREESCALE SEMICONDUCTOR, INC. | 2
| 2005
|
COLDWATT, INC. | 1
| 2007
|
SOITEC | 10
22 10 13 4 3 1 | 2010
2011 2012 2013 2014 2015 2016 |
SONY SEMICONDUCTOR SOLUTIONS CORPORATION | 1
| 2011
|
SADAKA, MARIAM | 1
| 2012
|
Inventor Addresses
Address | Duration |
---|---|
Austin, TE, US | Dec 18, 14 - Dec 18, 14 |
Austin, TX | Dec 28, 06 - Jun 28, 07 |
Austin, TX, US | Jan 01, 09 - Jan 16, 24 |
Technology Profile
Technology | Matters | |
---|---|---|
B01L: | CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE | 1 |
B05D: | PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL | 1 |
B22F: | WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER | 1 |
Patents / Publication
Patents / Publication # | Year of Publication / Issued | Title | Citations |
---|---|---|---|
11876348 | 2024 | Trench process for dense VCSEL design | 0 |
2022/0102,940 | 2022 | Trench Process for Dense VCSEL Design | 0 |
2020/0331,750 | 2020 | METHODS OF FABRICATING SEMICONDUCTOR STRUCTURES INCLUDING CAVITIES FILLED WITH A SACRIFICIAL MATERIAL | 1 |
10703627 | 2020 | Methods of fabricating semiconductor structures including cavities filled with a sacrificial material | 0 |
2020/0168,584 | 2020 | METHODS OF FORMING BONDED SEMICONDUCTOR STRUCTURES, AND SEMICONDUCTOR STRUCTURES FORMED BY SUCH METHODS | 2 |
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