Shinji Sugatani

Inventor

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Work History

Patent OwnerApplications FiledYear
ADVANTEST CORPORATION
2
2
2014
2015
INTEL CORPORATION
2
1
1
2015
2016
2017
SOCIONEXT INC.
2
2002
FUJITSU LIMITED
1
1
2
2
1986
1998
2002
2003
FUJITSU SEMICONDUCTOR LIMITED
6
4
1
3
2002
2004
2009
2012
MICROELECTRONICS LTD.
1
2009

Inventor Addresses

AddressDuration
Gunma, JPOct 27, 16 - Feb 25, 20
Hachiohji, JPNov 29, 12 - Jul 23, 13
Kawasaki, JPAug 21, 01 - Dec 31, 09
Machida, JPMar 29, 88 - Mar 29, 88
Saitama, JPMar 03, 16 - Jan 23, 25
Tokyo, JPJul 16, 15 - Oct 04, 22

Technology Profile

Technology Matters
B22F: WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER 2
B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 3
B28B: SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS, SLAG OR MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER 1

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Patents / Publication

Patents / Publication #Year of Publication / IssuedTitleCitations
2025/0031,4552025THREE-DIMENSIONAL DEVICE AND MANUFACTURING METHOD THEREOF0
2024/0290,7412024SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD0
2024/0234,3082024SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS0
2024/0234,3522024STACKED CHIP AND FABRICATION METHOD OF STACKED CHIP0
2024/0186,2082024METHOD, STRUCTURE, AND MANUFACTURING METHOD FOR EXPANDING CHIP HEAT DISSIPATION AREA0

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