Keisuke SUDA

Inventor

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Work History

Patent OwnerApplications FiledYear
APIC YAMADA CORPORATION
3
1
2013
2016
HONDA MOTOR CO., LTD.
6
2
2
2010
2013
2015

Inventor Addresses

AddressDuration
Chikuma, JPMar 07, 17 - Nov 28, 17
Chikuma-shi, JPMar 16, 17 - Mar 16, 17
Chikuma-shi, Nagano, JPOct 22, 15 - Oct 22, 15
Nagano, JPDec 17, 20 - Dec 17, 20
Utsunomiya, JPMay 27, 14 - Mar 22, 16
Utsunomiya-shi, JPDec 09, 10 - Dec 19, 13
Wako, JPMay 26, 11 - Jun 20, 17
Yokkaichi Mie, JPOct 24, 19 - Feb 18, 25
Yokkaichi, JPSep 19, 19 - Nov 21, 24

Technology Profile

Technology Matters
B05B: SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES 1
B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING 1
B41M: PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING 1

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Patents / Publication

Patents / Publication #Year of Publication / IssuedTitleCitations
122303262025Semiconductor memory device with conductive layers separated between memory blocks0
2024/0389,3282024MEMORY DEVICE0
120698552024Semiconductor memory0
2024/0276,7212024SEMICONDUCTOR MEMORY DEVICE0
2024/0096,4162024SEMICONDUCTOR MEMORY DEVICE0

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