Takuya Seino
Inventor
Stats
- 14 US patents issued
- 30 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 14 US Patents Issued
- 30 US Applications Filed
- 215 Total Citation Count
- Oct 21, 2024 Most Recent Filing
- Jul 12, 2005 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| TDK CORPORATION | 2
| 2007
|
| CANON ANELVA CORPORATION | 3
4 1 5 3 4 5 2 | 2009
2010 2011 2012 2014 2015 2016 2017 |
| ALPS ELECTRIC CO., LTD. | 4
4 1 | 2005
2007 2008 |
Inventor Addresses
| Address | Duration |
|---|---|
| Gyeonggi-do, KR | Feb 06, 25 - Feb 06, 25 |
| Kawasaki, JP | Oct 05, 10 - Jun 15, 21 |
| Kawasaki-shi, JP | Dec 03, 09 - Nov 02, 17 |
| Niigata-ken, JP | Jul 19, 07 - Mar 01, 11 |
| Tokyo, JP | Jan 19, 06 - Jan 28, 25 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B05C: | APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL | 1 |
| C23C: | COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL | 7 |
| C30B: | SINGLE-CRYSTAL GROWTH | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 2025/0044,704 | 2025 | SUBSTRATE PROCESSING METHOD, COMPUTER RECORDING MEDIUM, SUBSTRATE PROCESSING SYSTEM, AND SUBSTRATE PROCESSING APPARATUS | 0 |
| 12211692 | 2025 | Wafer processing method | 0 |
| 2023/0178,378 | 2023 | ETCHING METHOD AND ETCHING APPARATUS | 0 |
| 2023/0051,865 | 2023 | PVD APPARATUS | 0 |
| 2021/0280,419 | 2021 | WAFER PROCESSING METHOD | 0 |
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