Roger A Quon
Inventor
Stats
- 33 US patents issued
- 65 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 33 US Patents Issued
- 65 US Applications Filed
- 391 Total Citation Count
- Aug 28, 2024 Most Recent Filing
- Jul 31, 2003 Earliest Filing
Work History
Patent Owner | Applications Filed | Year |
---|---|---|
ULTRATECH, INC. | 2
4 | 2004
2006 |
INTERNATIONAL BUSINESS MACHINES CORPORATION | 4
3 1 1 2 2 2 1 2 12 3 | 2003
2004 2005 2006 2008 2009 2010 2011 2012 2016 2017 |
CHARTERED SEMICONDUCTOR MANUFACTURING LTD. | 2
| 2008
|
INVENSAS CORPORATION | 2
2 4 1 | 2003
2004 2005 2009 |
SAMSUNG ELECTRONICS CO., LTD. | 2
| 2008
|
GLOBALFOUNDRIES INC. | 1
2 2 2 5 | 2005
2006 2007 2008 2015 |
Inventor Addresses
Address | Duration |
---|---|
Albany, NY, US | Apr 12, 18 - Jun 05, 18 |
Austin, TX, US | May 05, 11 - Nov 05, 13 |
Beacon, NY | Feb 07, 06 - Feb 07, 06 |
Beacon, NY, US | Aug 11, 09 - Aug 11, 09 |
Hopewell Junction, NY, US | Dec 23, 10 - Jul 02, 13 |
RHINEBECK, NY, US | Oct 18, 18 - Sep 12, 19 |
Rhineback, NY, US | Mar 21, 24 - Oct 01, 24 |
Rhinebeck, NY | Feb 03, 05 - Oct 28, 08 |
Rhinebeck, NY, US | Mar 24, 05 - Feb 20, 25 |
Technology Profile
Technology | Matters | |
---|---|---|
B05D: | PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL | 2 |
C23C: | COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL | 3 |
C23F: | NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACES | 1 |
Patents / Publication
Patents / Publication # | Year of Publication / Issued | Title | Citations |
---|---|---|---|
2025/0062,126 | 2025 | SELF ALIGNED PATTERN FORMATION POST SPACER ETCHBACK IN TIGHT PITCH CONFIGURATIONS | 0 |
12106963 | 2024 | Self aligned pattern formation post spacer etchback in tight pitch configurations | 0 |
2024/0096,627 | 2024 | SELF ALIGNED PATTERN FORMATION POST SPACER ETCHBACK IN TIGHT PITCH CONFIGURATIONS | 0 |
11670510 | 2023 | Self aligned pattern formation post spacer etchback in tight pitch configurations | 1 |
11133216 | 2021 | Interconnect structure | 1 |
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