Dennis R Pyper
Inventor
Stats
- 13 US patents issued
- 26 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 13 US Patents Issued
- 26 US Applications Filed
- 531 Total Citation Count
- Jul 21, 2021 Most Recent Filing
- Jun 4, 2010 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| APPLE INC. | 4
1 12 2 7 4 4 | 2010
2011 2012 2013 2014 2015 2016 |
Inventor Addresses
| Address | Duration |
|---|---|
| Cupertino, CA, US | May 09, 13 - Apr 14, 20 |
| San Jose, CA, US | Oct 20, 11 - Jul 16, 24 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B23C: | MILLING | 1 |
| B29C: | SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING | 1 |
| B32B: | LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 12040262 | 2024 | Flex board and flexible module | 0 |
| 10631410 | 2020 | Stacked printed circuit board packages | 0 |
| 10624214 | 2020 | Low-profile space-efficient shielding for SIP module | 0 |
| 10470307 | 2019 | Circuit substrate with embedded heat sink | 4 |
| 10455738 | 2019 | Stacked circuit board architecture in an electronic device | 2 |
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