Jared Pettit
Inventor
Stats
- 2 US patents issued
- 7 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 2 US Patents Issued
- 7 US Applications Filed
- 38 Total Citation Count
- Dec 12, 2018 Most Recent Filing
- Feb 28, 2014 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| Daetec, LLC | 2
1 | 2015
2016 |
| H.C. STARCK INC. | 2
1 | 2015
2016 |
Inventor Addresses
| Address | Duration |
|---|---|
| Camarillo, CA, US | Sep 10, 15 - Feb 16, 21 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B32B: | LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM | 2 |
| C08K: | USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS | 2 |
| C09D: | COATING COMPOSITIONS, e.g. PAINTS, VARNISHES, LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 10923514 | 2021 | Etch chemistries for metallization in electronic devices | 0 |
| 2019/0148,420 | 2019 | ETCH CHEMISTRIES FOR METALLIZATION IN ELECTRONIC DEVICES | 0 |
| 10290531 | 2019 | Release layer for subsequent manufacture of flexible substrates in microelectronic applications | 0 |
| 10186530 | 2019 | Etch chemistries for metallization in electronic devices | 1 |
| 10000675 | 2018 | Temporary adhesive with tunable adhesion force sufficient for processing thin solid materials | 0 |
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