Ponnusamy Palanisamy

Inventor

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Work History

Patent OwnerApplications FiledYear
LIGHTING SCIENCE GROUP CORPORATION
1
2002
SARNOFF CORPORATION
3
2
2002
2003
INTEL CORPORATION
7
1
2001
2002
DELPHI TECHNOLOGIES, INC.
1
2
5
1
1987
1988
1989
1990
GENERAL MOTORS CORPORATION
1
1981
CASANTRA ACQUISITION III LLC
1
1
1
1
1988
1989
1991
1993
TRANSPACIFIC INFINITY, LLC
4
2
3
2003
2004
2007
K/S HIMPP
2
2
2000
2006
BEIJING XIAOMI MOBILE SOFTWARE CO., LTD.
2
2001
DELCO ELECTRONICS CORPORATION
1
1987

Inventor Addresses

AddressDuration
133 Claremont Dr.Sep 14, 10 - Nov 09, 10
Kokoma, INNov 17, 92 - Nov 17, 92
Kokomo, INJun 05, 84 - Jan 05, 93
Landsdale, PAJan 16, 03 - Jan 16, 03
Landsdale, PA, USFeb 20, 03 - Feb 20, 03
Lansdale, PAMar 07, 95 - May 31, 07
Lansdale, PA, USJan 16, 03 - Jul 28, 22

Technology Profile

Technology Matters
B22F: WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER 1
B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 1
B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM 3

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Patents / Publication

Patents / Publication #Year of Publication / IssuedTitleCitations
2022/0238,2612022High Adhesion Resistive Composition0
2022/0225,5012022CONDUCTIVE THICK FILM PASTE FOR SILICON NITRIDE AND OTHER SUBSTRATES0
RE425422011Low-cost circuit board materials and processes for area array electrical interconnections over a large area between a device and the circuit board1
RE419142010Thermal management in electronic displays2
RE416692010Low-cost circuit board materials and processes for area array electrical interconnections over a large area between a device and the circuit board0

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