Ponnusamy Palanisamy
Inventor
Stats
- 31 US patents issued
- 38 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 31 US Patents Issued
- 38 US Applications Filed
- 1094 Total Citation Count
- May 26, 2020 Most Recent Filing
- Aug 20, 1981 Earliest Filing
Work History
Patent Owner | Applications Filed | Year |
---|---|---|
LIGHTING SCIENCE GROUP CORPORATION | 1
| 2002
|
SARNOFF CORPORATION | 3
2 | 2002
2003 |
INTEL CORPORATION | 7
1 | 2001
2002 |
DELPHI TECHNOLOGIES, INC. | 1
2 5 1 | 1987
1988 1989 1990 |
GENERAL MOTORS CORPORATION | 1
| 1981
|
CASANTRA ACQUISITION III LLC | 1
1 1 1 | 1988
1989 1991 1993 |
TRANSPACIFIC INFINITY, LLC | 4
2 3 | 2003
2004 2007 |
K/S HIMPP | 2
2 | 2000
2006 |
BEIJING XIAOMI MOBILE SOFTWARE CO., LTD. | 2
| 2001
|
DELCO ELECTRONICS CORPORATION | 1
| 1987
|
Inventor Addresses
Address | Duration |
---|---|
133 Claremont Dr. | Sep 14, 10 - Nov 09, 10 |
Kokoma, IN | Nov 17, 92 - Nov 17, 92 |
Kokomo, IN | Jun 05, 84 - Jan 05, 93 |
Landsdale, PA | Jan 16, 03 - Jan 16, 03 |
Landsdale, PA, US | Feb 20, 03 - Feb 20, 03 |
Lansdale, PA | Mar 07, 95 - May 31, 07 |
Lansdale, PA, US | Jan 16, 03 - Jul 28, 22 |
Technology Profile
Technology | Matters | |
---|---|---|
B22F: | WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER | 1 |
B23K: | SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM | 1 |
B32B: | LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM | 3 |
Patents / Publication
Patents / Publication # | Year of Publication / Issued | Title | Citations |
---|---|---|---|
2022/0238,261 | 2022 | High Adhesion Resistive Composition | 0 |
2022/0225,501 | 2022 | CONDUCTIVE THICK FILM PASTE FOR SILICON NITRIDE AND OTHER SUBSTRATES | 0 |
RE42542 | 2011 | Low-cost circuit board materials and processes for area array electrical interconnections over a large area between a device and the circuit board | 1 |
RE41914 | 2010 | Thermal management in electronic displays | 2 |
RE41669 | 2010 | Low-cost circuit board materials and processes for area array electrical interconnections over a large area between a device and the circuit board | 0 |
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