Sang-yearl Park
Inventor
Stats
- 1 US patents issued
- 2 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 1 US Patents Issued
- 2 US Applications Filed
- 4 Total Citation Count
- Nov 27, 2012 Most Recent Filing
- Dec 16, 2009 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| HAESUNG DS CO., LTD. | 1
| 2012
|
| MDS CO. LTD. | 2
| 2009
|
Inventor Addresses
| Address | Duration |
|---|---|
| Changwon, KR | Aug 16, 11 - Aug 16, 11 |
| Changwon-city, KR | Jul 29, 10 - Aug 08, 13 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B32B: | LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM | 1 |
| H01L: | SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | 2 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 2013/0200,506 | 2013 | METHOD OF PREVENTING EPOXY BLEED OUT OF LEAD FRAME AND LEAD FRAME MANUFACTURED BY USING THE SAME | 3 |
| 7999396 | 2011 | Adhesive tape and semiconductor package using the same | 0 |
| 2010/0187,673 | 2010 | ADHESIVE TAPE AND SEMICONDUCTOR PACKAGE USING THE SAME | 1 |
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