Tamotsu Owada

Inventor

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Work History

Patent OwnerApplications FiledYear
FUJITSU MICROELECTRONICS LIMITED
1
2
2002
2005
FUJITSU LIMITED
2
2
2
1
1993
2003
2005
2006
FUJITSU SEMICONDUCTOR LIMITED
2
1
4
2
6
4
3
8
6
2
4
5
6
2
2001
2002
2003
2004
2005
2006
2007
2008
2009
2011
2012
2013
2014
2015

Inventor Addresses

AddressDuration
Kawasaki, JPSep 20, 94 - Jul 15, 14
Kawasaki-shi, JPOct 25, 01 - Feb 02, 06
Shinjuku, JPNov 12, 09 - Mar 11, 14
Tokyo, JPJul 01, 10 - May 15, 14
Yokohama, JPOct 06, 11 - Jan 12, 16

Technology Profile

Technology Matters
B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 2
B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM 1
C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS 1

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Patents / Publication

Patents / Publication #Year of Publication / IssuedTitleCitations
92363022016Semiconductor device and manufacturing method of semiconductor device0
91237282015Semiconductor device and method for manufacturing semiconductor device0
2015/0235,9012015SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE0
90878732015Semiconductor device manufacturing method7
2015/0069,5862015SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME0

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