Teppei OTSUKI
Inventor
Stats
- 0 US patents issued
- 1 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 0 US Patents Issued
- 1 US Applications Filed
- 1 Total Citation Count
- Jan 16, 2019 Most Recent Filing
- Jan 16, 2019 Earliest Filing
Work History
No Work History Available.Inventor Addresses
| Address | Duration |
|---|---|
| Soka, JP | Dec 05, 23 - Dec 05, 23 |
| Soka-shi, JP | Mar 04, 21 - Mar 04, 21 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B23K: | SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM | 1 |
| C08K: | USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS | 1 |
| C08L: | COMPOSITIONS OF MACROMOLECULAR COMPOUNDS | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 11833620 | 2023 | Flux and solder paste | 0 |
| 2021/0060,715 | 2021 | FLUX AND SOLDER PASTE | 1 |
We are sorry but your current selection exceeds the maximum number of portfolios (0) for this membership level.
>
Upgrade to our Level for up to -1 portfolios!.