Kanji Otsuka
Inventor
Stats
- 64 US patents issued
- 72 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 64 US Patents Issued
- 72 US Applications Filed
- 2541 Total Citation Count
- May 30, 2022 Most Recent Filing
- Jun 14, 1982 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| TOSHIBA CORPORATION | 2
| 2003
|
| HITACHI, LTD. | 1
2 1 1 2 4 5 5 4 1 | 1982
1983 1984 1986 1987 1989 1990 1991 1992 1999 |
| SONY CORPORATION | 2
2 7 4 4 6 2 | 1999
2000 2001 2002 2003 2004 2006 |
| MEISEI GAKUEN | 1
2 1 | 2009
2014 2015 |
| NEC CORPORATION | 2
2 7 4 4 6 2 1 | 1999
2000 2001 2002 2003 2004 2006 2009 |
| Yuko TANBA | 1
| 2007
|
| NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY | 2
| 2003
|
| SHARP KABUSHIKI KAISHA | 2
2 7 4 4 6 2 | 1999
2000 2001 2002 2003 2004 2006 |
| SHIN-ETSU POLYMER CO., LTD. | 1
| 2009
|
| YUTAKA AKIYAMA | 1
2 | 2007
2008 |
| FUJITSU SEMICONDUCTOR LIMITED | 2
2 7 9 4 6 4 2 6 1 | 1999
2000 2001 2002 2003 2004 2006 2007 2008 2009 |
| BUFFALO MEMORY CO., LTD. | 2
| 2014
|
| NISSAN CHEMICAL INDUSTRIES, LTD. | 1
1 | 1982
1990 |
| KABUSHIKI KAISHA TOSHIBA | 2
2 7 6 2 6 6 2 6 | 1999
2000 2001 2002 2003 2004 2006 2007 2008 |
| NAGASE & CO., LTD. | 2
| 2013
|
| SANYO ELECTRIC CO., LTD. | 2
2 7 6 4 6 4 | 1999
2000 2001 2002 2003 2004 2006 |
| OTSUKA, KANJI | 1
2 | 2002
2006 |
| PANASONIC CORPORATION | 2
2 2 | 2002
2004 2006 |
| Tsuneo ITO | 1
| 2007
|
| MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. | 2
2 7 3 4 4 3 | 1999
2000 2001 2002 2003 2004 2006 |
| DISCO CORPORATION | 3
| 2012
|
| USAMI, TAMOTSU | 1
2 2 | 2002
2004 2006 |
| LONGITUDE SEMICONDUCTOR S.A.R.L. | 2
| 2005
|
| MATSUSHITA ELECTRONICS CORPORATION | 1
| 2002
|
| KYOCERA CORPORATION | 2
2 6 | 2006
2007 2008 |
| KYOCERA CORPORATION | 1
| 2009
|
| RENESAS ELECTRONICS CORPORATION | 2
2 2 7 9 4 6 6 2 6 | 1993
1999 2000 2001 2002 2003 2004 2006 2007 2008 |
| ROHM CO., LTD. | 1
2 7 6 4 6 4 | 1999
2000 2001 2002 2003 2004 2006 |
| IBIDEN CO., LTD. | 6
1 | 2008
2009 |
| Jjtech Co., Ltd. | 2
| 2006
|
| HITACHI ULSI ENGINEERING CORP. | 1
| 1993
|
| KANJI OTSUKA | 1
3 2 2 1 2 | 2001
2002 2003 2004 2007 2008 |
| MITSUBISHI DENKI KABUSHIKI KAISHA | 1
| 1999
|
| SCINTICOR INCORPORATED, A WI CORP. | 1
| 1992
|
| SK Link Co., Ltd. | 1
| 2012
|
| TAMOTSU USAMI | 1
2 2 1 1 | 2001
2002 2003 2004 2007 |
| FUJIKURA LTD. | 2
| 2004
|
| HITACHI VLSI ENGINEERING CORP. | 3
3 3 2 1 | 1989
1990 1991 1992 1993 |
| FUJI XEROX CO., LTD. | 2
2 6 5 | 2006
2007 2008 2009 |
| LAPIS SEMICONDUCTOR CO., LTD. | 2
2 7 7 4 6 4 2 4 | 1999
2000 2001 2002 2003 2004 2006 2007 2008 |
| TAMA-TLO, LTD. | 2
1 2 | 2006
2007 2009 |
| DENSO CORPORATION | 1
| 2015
|
Inventor Addresses
| Address | Duration |
|---|---|
| 1074-38, Kohan 2-chome | Sep 07, 10 - Sep 07, 10 |
| 1074-38, Kohan 2-chome, Higashiyamato-shi, Tokyo 207-0002, JP | Dec 30, 03 - Nov 02, 04 |
| 1074-38, Kohan 2-chome, Higashiyamato-shi, Tokyo, 207-0002, JP | Feb 18, 03 - Feb 17, 04 |
| 1074-38, Kohan 2-chome, Higashiyamato-shi, Tokyo, JP | Apr 16, 02 - Apr 16, 02 |
| 2-1074-38 Kohan, Higashiyamamto-shi, Tokyo, JP | Dec 13, 05 - Dec 13, 05 |
| 2-1074-38, Kohan | Jan 18, 11 - Jan 18, 11 |
| Funabashi, JP | May 08, 84 - Oct 01, 91 |
| Higashi-Yamato, JP | Mar 01, 88 - Mar 01, 88 |
| Higashiyamato, JP | Jul 09, 85 - May 27, 14 |
| Higashiyamato-Shi, JP | Jan 09, 03 - Jan 09, 03 |
| Higashiyamato-shi, JP | Sep 14, 06 - Mar 07, 13 |
| Higashiyamato-shi, Tokyo 207-0002, JP | Nov 04, 08 - Nov 04, 08 |
| Higashiyamato-shi, Tokyo, JP | Nov 01, 05 - Nov 04, 08 |
| Higashiyamoto, JP | Oct 25, 94 - May 04, 04 |
| Higashiyamoto-shi, JP | Apr 18, 02 - Apr 18, 02 |
| Hino, JP | Jan 09, 18 - Jan 09, 18 |
| Hino-shi, JP | Jul 21, 16 - Jul 21, 16 |
| Kohan 2 - 1074 - 38, Higashiyamato-Shi Tokyo, JP | Nov 05, 02 - Nov 05, 02 |
| Kohan 2-1074-38 | Dec 15, 09 - Dec 15, 09 |
| Kohan 2-1074-38, Higashiyamato-Shi, Tokyo, JP | Oct 07, 03 - Oct 07, 03 |
| Kohan, Higashiyamato-shi, Tokyo 207-0002, JP | Jul 05, 05 - Jul 05, 05 |
| Kohan, Higashiyamato-shi, Tokyo, JP | Oct 09, 07 - Oct 09, 07 |
| Tokyo, JP | Aug 02, 01 - Aug 15, 24 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B22D: | CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES | 1 |
| B23K: | SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM | 4 |
| C07C: | ACYCLIC OR CARBOCYCLIC COMPOUNDS | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 2024/0274,571 | 2024 | SEMICONDUCTOR SUBSTRATE ASSEMBLY AND MANUFACTURING METHOD THEREFOR | 0 |
| 10423666 | 2019 | Writing method and semiconductor device including a search memory mat with write processing terminated when one piece of divided key data is successfully written | 0 |
| 2018/0129,756 | 2018 | SEMICONDUCTOR DEVICE AND INFORMATION WRITING/READING METHOD | 2 |
| 9866219 | 2018 | Device for logic operation | 0 |
| 2016/0211,851 | 2016 | DEVICE FOR LOGIC OPERATION | 0 |
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