Takuya Okamachi

Inventor

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Work History

Patent OwnerApplications FiledYear
C. UYEMURA & CO., LTD.
1
2
2
2011
2013
2014

Inventor Addresses

AddressDuration
Osaka, JPSep 08, 11 - Oct 31, 24

Technology Profile

Technology Matters
B05B: SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES 1
B05C: APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL 1
C09K: MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR 1

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Patents / Publication

Patents / Publication #Year of Publication / IssuedTitleCitations
2024/0360,5862024METHOD AND SYSTEM FOR REGENERATING ELECTROLYTIC COPPER PLATING SOLUTION0
115606402023Filling plating system and filling plating method0
2018/0195,1932018FILLING PLATING SYSTEM AND FILLING PLATING METHOD0
93749132016Pretreatment agent for electroless plating, and pretreatment and production of printed wiring board using same2
93596762016Surface treating apparatus2

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