Takuya Okamachi
Inventor
Stats
- 2 US patents issued
- 5 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 2 US Patents Issued
- 5 US Applications Filed
- 18 Total Citation Count
- Apr 24, 2024 Most Recent Filing
- Mar 1, 2011 Earliest Filing
Work History
Patent Owner | Applications Filed | Year |
---|---|---|
C. UYEMURA & CO., LTD. | 1
2 2 | 2011
2013 2014 |
Inventor Addresses
Address | Duration |
---|---|
Osaka, JP | Sep 08, 11 - Oct 31, 24 |
Technology Profile
Technology | Matters | |
---|---|---|
B05B: | SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES | 1 |
B05C: | APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL | 1 |
C09K: | MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR | 1 |
Patents / Publication
Patents / Publication # | Year of Publication / Issued | Title | Citations |
---|---|---|---|
2024/0360,586 | 2024 | METHOD AND SYSTEM FOR REGENERATING ELECTROLYTIC COPPER PLATING SOLUTION | 0 |
11560640 | 2023 | Filling plating system and filling plating method | 0 |
2018/0195,193 | 2018 | FILLING PLATING SYSTEM AND FILLING PLATING METHOD | 0 |
9374913 | 2016 | Pretreatment agent for electroless plating, and pretreatment and production of printed wiring board using same | 2 |
9359676 | 2016 | Surface treating apparatus | 2 |
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