Hironobu OZAWA

Inventor

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Work History

Patent OwnerApplications FiledYear
TOPPAN PRINTING CO., LTD.
1
2
2014
2015
TOKYO UNIVERSITY OF SCIENCE EDUCATIONAL FOUNDATION ADMINISTRATIVE ORGANIZATION
1
2
2014
2015

Inventor Addresses

AddressDuration
Tokyo, JPSep 11, 14 - Jan 16, 25

Technology Profile

Technology Matters
B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 1
B24B: MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING 2
H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE 3

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Patents / Publication

Patents / Publication #Year of Publication / IssuedTitleCitations
2025/0018,5312025WAFER GRINDING METHOD0
2024/0194,5012024WAFER PROCESSING APPARATUS0
2024/0165,7662024GRINDING METHOD OF WORKPIECE0
2015/0302,9962015PHOTOELECTRODE FOR DYE-SENSITIZED SOLAR CELLS, AND DYE-SENSITIZED SOLAR CELL0
2015/0187,5122015COUNTER ELECTRODE FOR DYE SENSITIZED SOLAR CELL AND DYE SENSITIZED SOLAR CELL0

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