Ken Okanishi

Inventor

Add to Portfolio

Stats

Details

Work History

Patent OwnerApplications FiledYear
DAIKIN INDUSTRIES, LTD.
1
1
2
2
1
3
1
1
1999
2000
2001
2004
2011
2014
2015
2016

Inventor Addresses

AddressDuration
Osaka, JPOct 04, 01 - Nov 30, 23
Osaka-Shi, Osaka, JPJan 21, 21 - Jan 21, 21
Osaka-shi, Osaka, JPAug 10, 17 - Jan 28, 21
Settsu, JPOct 15, 02 - Jul 23, 19
Settsu, Osaka, JPOct 27, 16 - Oct 27, 16
Settsu-shi, Osaka, JPMay 26, 16 - May 26, 16

Technology Profile

Technology Matters
B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING 2
B29K: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS 1
B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM 1

See more…

Patents / Publication

Patents / Publication #Year of Publication / IssuedTitleCitations
2023/0383,0302023MODIFIED FLUORORESIN MATERIAL, MATERIAL FOR CIRCUIT BOARD, LAMINATE FOR CIRCUIT BOARD, CIRCUIT BOARD, AND METHOD FOR PRODUCING MODIFIED FLUORORESIN MATERIAL0
117732252023Molded article0
2022/0127,3972022PROCESSING ADDITIVE, MOLDING COMPOSITION, MASTERBATCH OF PROCESSING ADDITIVE AND MOLDING ARTICLE0
112741722022Processing additive, molding composition masterbatch of processing additive and molding article0
2021/0024,7092021MOLDED ARTICLE0

See more…


We are sorry but your current selection exceeds the maximum number of portfolios (0) for this membership level.
> Upgrade to our Level for up to -1 portfolios!.