Shin-ichi Ohkoshi

Inventor

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Work History

Patent OwnerApplications FiledYear
DOWA ELECTRONICS MATERIALS CO., LTD.
2
6
4
4
2
1
2
2006
2007
2008
2010
2014
2015
2016
TANAKA KIKINZOKU KOGYO K.K.
1
2015
THE UNIVERSITY OF TOKYO
2
6
4
4
4
2
3
4
2
2
2006
2007
2008
2009
2010
2011
2014
2015
2016
2017
TOYOTA JIDOSHA KABUSHIKI KAISHA
1
2017
TOKYO OHKA KOGYO CO., LTD.
2
1
2015
2017

Inventor Addresses

AddressDuration
USDec 07, 17 - Dec 07, 17
Tokyo, JPSep 20, 07 - Aug 15, 24

Technology Profile

Technology Matters
B05D: PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL 3
B22F: WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER 1
B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM 6

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Patents / Publication

Patents / Publication #Year of Publication / IssuedTitleCitations
2024/0271,8802024HEAT ABSORPTION AND RADIATION SYSTEM0
119800132024Radio wave-absorbing laminate film, production method therefor, and element including same0
2023/0307,8442023RADIO WAVE ABSORBER AND PASTE FOR FORMING RADIO WAVE ABSORBER0
115746522023Recording device and recording method0
115391412022Radio wave absorber0

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