HEINZ NOLDEN
Inventor
Stats
- 0 US patents issued
- 2 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 0 US Patents Issued
- 2 US Applications Filed
- 0 Total Citation Count
- Jul 27, 2021 Most Recent Filing
- Jun 5, 2020 Earliest Filing
Work History
No Work History Available.Inventor Addresses
| Address | Duration |
|---|---|
| Bad Salzdetfurth, DE | Jul 27, 23 - Mar 11, 25 |
| Meisenheim-Glan, DE | Aug 18, 22 - Sep 17, 24 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B23K: | SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM | 2 |
| H01L: | SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 12246387 | 2025 | Device for shifting at least one sub-assembly between a provisioning zone and working zone | 0 |
| 12090577 | 2024 | Device for soldering | 0 |
| 2023/0234,152 | 2023 | DEVICE FOR SHIFTING AT LEAST ONE SUB-ASSEMBLY BETWEEN A PROVISIONING ZONE AND WORKING ZONE | 0 |
| 2022/0258,265 | 2022 | DEVICE FOR SOLDERING | 0 |
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