Naoki Noda
Inventor
Stats
- 7 US patents issued
- 11 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 7 US Patents Issued
- 11 US Applications Filed
- 459 Total Citation Count
- Sep 2, 2013 Most Recent Filing
- Apr 9, 1987 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| NIPPON INSTRUMENTS CORPORATION | 1
1 1 | 2001
2003 2004 |
| PIONEER CORPORATION | 4
2 | 2009
2010 |
| TOYOTA JIDOSHA KABUSHIKI KAISHA | 1
| 1987
|
| CENTRAL RESEARCH INSTITUTE OF ELECTRIC POWER INDUSTRY | 1
| 2004
|
| PIONEER MICRO TECHNOLOGY CORPORATION | 4
2 | 2009
2010 |
| NORITAKE CO., LIMITED | 2
| 2013
|
| PIONEER VIDEO CORPORATION | 2
| 2002
|
| TOHOKU PIONEER CORPORATION | 2
| 2002
|
| PANASONIC CORPORATION | 1
| 2004
|
| NORITAKE ITRON CORPORATION | 2
| 2013
|
| JNC CORPORATION | 1
| 1996
|
Inventor Addresses
| Address | Duration |
|---|---|
| Chiba, JP | May 12, 98 - May 12, 98 |
| Kanagawa, JP | Sep 25, 03 - Dec 05, 06 |
| Kawasaki, JP | Aug 15, 13 - Nov 25, 14 |
| Kofu-shi, JP | Dec 06, 12 - Dec 20, 12 |
| Mie, JP | Sep 10, 15 - Sep 13, 16 |
| Osaka, JP | Mar 29, 07 - Mar 29, 07 |
| Toyota, JP | Dec 01, 87 - Dec 01, 87 |
| Yamanashi, JP | Feb 13, 03 - Nov 26, 13 |
| Yokosuka-shi, JP | Dec 02, 04 - Dec 02, 04 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B23K: | SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM | 1 |
| B81C: | PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS | 1 |
| C07F: | ACYCLIC, CARBOCYCLIC, OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM, OR TELLURIUM | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 9443831 | 2016 | Substrate for mounting LED element, LED light source and LED display | 0 |
| 2015/0255,436 | 2015 | SUBSTRATE FOR MOUNTING LED ELEMENT, LED LIGHT SOURCE AND LED DISPLAY | 0 |
| 8896132 | 2014 | Electronic device and fabrication method thereof | 1 |
| 8592285 | 2013 | Method of bonding semiconductor substrate and MEMS device | 2 |
| 2013/0207,277 | 2013 | ELECTRONIC DEVICE AND FABRICATION METHOD THEREOF | 1 |
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