Hiroyuki Nishioka

Inventor

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Work History

Patent OwnerApplications FiledYear
SHIMADZU CORPORATION
1
1986
IBIDEN CO., LTD.
2
5
1
2
2011
2014
2015
2017

Inventor Addresses

AddressDuration
Kyoto, JPApr 14, 87 - Apr 14, 87
Ogaki, JPDec 02, 14 - Jul 30, 19
Ogaki-shi, JPJun 21, 12 - Jun 11, 15
Tokyo, JPAug 03, 23 - Aug 03, 23

Technology Profile

Technology Matters
B05D: PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL 1
B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM 1
C08F: MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS 2

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Patents / Publication

Patents / Publication #Year of Publication / IssuedTitleCitations
2023/0245,8132023ELECTRONIC COMPONENT0
103684382019Printed wiring board and method for manufacturing the same1
2017/0303,3962017PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME2
2017/0303,3942017PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME1
95917712017Printed wiring board and method for manufacturing printed wiring board0

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