TERUHIKO NISHIKAWA

Inventor

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Inventor Addresses

AddressDuration
Tokyo, JPJun 17, 21 - Apr 23, 24

Technology Profile

Technology Matters
B23C: MILLING 4
B23Q: DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING 2
B24B: MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING 4

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Patents / Publication

Patents / Publication #Year of Publication / IssuedTitleCitations
119643612024Workpiece processing device and method0
115717852023Workpiece processing device and method0
115048692022Workpiece processing device and method0
114720552022Workpiece processing device and method1
2021/0283,7452021WORKPIECE PROCESSING DEVICE AND METHOD0

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