Robert Nickerson
Inventor
Stats
- 13 US patents issued
- 28 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 13 US Patents Issued
- 28 US Applications Filed
- 291 Total Citation Count
- Sep 29, 2023 Most Recent Filing
- Jun 30, 2003 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| Therma-Flite, Inc. | 1
4 2 | 2009
2012 2014 |
| INTEL CORPORATION | 4
6 3 2 2 2 2 2 | 2003
2004 2007 2008 2012 2013 2014 2015 |
| MICRON TECHNOLOGY, INC. | 2
| 2003
|
Inventor Addresses
| Address | Duration |
|---|---|
| Benicia, CA, US | Aug 16, 12 - Jun 03, 14 |
| Chandler, AZ | Jan 05, 06 - May 20, 08 |
| Chandler, AZ, US | Dec 30, 04 - Jan 25, 24 |
| Vallejo, CA, US | Mar 04, 10 - Sep 20, 16 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B23K: | SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM | 2 |
| B29C: | SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING | 1 |
| B29K: | INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 2024/0030,116 | 2024 | ULTRA-THIN, HYPER-DENSITY SEMICONDUCTOR PACKAGES | 0 |
| 2023/0197,659 | 2023 | SOLDER GRID ARRAY FOR ATTACHMENT OF A DIE PACKAGE | 0 |
| 2023/0138,543 | 2023 | ULTRA-THIN, HYPER-DENSITY SEMICONDUCTOR PACKAGES | 0 |
| 2022/0344,247 | 2022 | ULTRA-THIN, HYPER-DENSITY SEMICONDUCTOR PACKAGES | 1 |
| 11462527 | 2022 | Micro-trenching mold interface in a pop package | 0 |
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