My N Nguyen
Inventor
Stats
- 27 US patents issued
- 33 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 27 US Patents Issued
- 33 US Applications Filed
- 416 Total Citation Count
- Oct 9, 2019 Most Recent Filing
- Sep 23, 1988 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| HONEYWELL ELECTRONIC MATERIALS, INC. | 1
3 | 1990
1999 |
| HENKEL CORPORATION | 2
1 3 1 1 | 1992
1993 1995 1998 2009 |
| NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORPORATION | 1
1 2 1 | 1990
1991 1993 1996 |
| ADVANCED APPLIED ADHESIVES, INC. | 1
| 1988
|
| JOHNSON MATTHEY ELECTRONICS, INC. | 1
| 1999
|
| JOHNSON MATTHEY INC. D/B/A JOHNSON MATTHEY PHARMA SERVICES | 1
1 | 1990
1991 |
| HENKEL IP & HOLDING GMBH | 2
2 1 1 | 1997
2013 2014 2016 |
| HONEYWELL INTERNATIONAL INC. | 1
2 2 3 1 | 1999
2002 2003 2004 2005 |
Inventor Addresses
| Address | Duration |
|---|---|
| Poway, CA | Jan 13, 98 - Jul 19, 07 |
| Poway, CA, US | Sep 23, 04 - Oct 26, 21 |
| Poway, GA, US | Sep 18, 14 - Sep 18, 14 |
| San Diego, CA | Jan 22, 91 - Mar 18, 97 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B05B: | SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES | 1 |
| B32B: | LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM | 7 |
| B65B: | MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING | 2 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 11155065 | 2021 | Compositions having a matrix and encapsulated phase change materials dispersed therein, and electronic devices assembled therewith | 0 |
| 2020/0042,055 | 2020 | COMPOSITIONS HAVING A MATRIX AND ENCAPSULATED PHASE CHANGE MATERIALS DISPERSED THEREIN, AND ELECTRONIC DEVICES ASSEMBLED THEREWITH | 0 |
| 10481653 | 2019 | Compositions having a matrix and encapsulated phase change materials dispersed therein, and electronic devices assembled therewith | 0 |
| 2019/0198,419 | 2019 | THERMALLY INSULATING COMPOSITION AND ELECTRONIC DEVICES ASSEMBLED THEREWITH | 1 |
| 2016/0334,844 | 2016 | COMPOSITIONS HAVING A MATRIX AND ENCAPSULATED PHASE CHANGE MATERIALS DISPERSED THEREIN, AND ELECTRONIC DEVICES ASSEMBLED THEREWITH | 4 |
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