Deepak Nayar
Inventor
Stats
- 1 US patents issued
- 5 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 1 US Patents Issued
- 5 US Applications Filed
- 82 Total Citation Count
- Aug 14, 2023 Most Recent Filing
- Jan 27, 1992 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| TYCO INTERNATIONAL LTD., A CORPORATION OF BERMUDA | 1
| 1992
|
| TYCO INTERNATIONAL (PA), INC., A CORPORATION OF NEVADA | 1
| 1992
|
| LITTELFUSE, INC. | 1
| 1992
|
Inventor Addresses
| Address | Duration |
|---|---|
| Chicago, IL, US | Dec 16, 21 - Nov 30, 23 |
| Dongguan City, CN | Apr 15, 21 - Apr 15, 21 |
| Hayward, CA | Apr 12, 94 - Apr 12, 94 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B05D: | PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL | 2 |
| C09D: | COATING COMPOSITIONS, e.g. PAINTS, VARNISHES, LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR | 2 |
| H01B: | CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING, OR DIELECTRIC PROPERTIES | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 2023/0383,139 | 2023 | Thin Film Coating Packaging for Device Having Meltable and Wetting Links | 0 |
| 11807770 | 2023 | Thin film coating packaging for device having meltable and wetting links | 0 |
| 11437212 | 2022 | Surface mount fuse with solder link and de-wetting substrate | 1 |
| 2021/0388,230 | 2021 | Thin Film Coating Packaging for Device Having Meltable and Wetting Links | 1 |
| 2021/0110,953 | 2021 | CIRCUIT PROTECTION APPARATUS INCLUDING STRUCTURALLY RESILIENT ELECTRICAL TRANSIENT MATERIAL AND METHOD FOR MAKING SAME | 1 |
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