Yasuo Nagaoka
Inventor
Stats
- 2 US patents issued
- 5 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 2 US Patents Issued
- 5 US Applications Filed
- 355 Total Citation Count
- Jun 18, 2015 Most Recent Filing
- Nov 29, 2005 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| SHIN-ETSU HANDOTAI CO., LTD. | 2
1 2 2 | 2005
2006 2008 2015 |
Inventor Addresses
| Address | Duration |
|---|---|
| Annaka, JP | May 13, 10 - May 08, 12 |
| Gunma, JP | May 01, 08 - May 07, 09 |
| Maebashi, JP | Nov 17, 16 - Aug 03, 17 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B24B: | MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING | 1 |
| C09G: | POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH; SKI WAXES | 1 |
| H01L: | SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | 5 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 2017/0216,992 | 2017 | METHOD FOR POLISHING GERMANIUM WAFER | 0 |
| 2016/0336,188 | 2016 | SEMICONDUCTOR-WAFER CLEANING TANK AND METHOD OF MANUFACTURING BONDED WAFER | 0 |
| 8173521 | 2012 | Method for manufacturing bonded wafer | 1 |
| 2010/0120,223 | 2010 | METHOD FOR MANUFACTURING BONDED WAFER | 8 |
| 2009/0117,706 | 2009 | Manufacturing Method of SOI Wafer and SOI Wafer Manufactured by This Method | 4 |
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