Minoru Murata

Inventor

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Work History

Patent OwnerApplications FiledYear
ARAKAWA CHEMICAL INDUSTRIES, LTD.
2
2008
NIKON CORPORATION
1
1
1
1996
1998
2000
YTS Co., Ltd.
1
2014
JAPAN NUCLEAR CYCLE DEVELOPMENT INSTITUTE
1
2003
NEC CORPORATION
1
4
2
1999
2007
2015
Nippondenso Co., Ltd.
1
1995
501 Yamada Yuki Seizo Co., Ltd.
1
1989
JVC KENWOOD CORPORATION
1
2015
MITSUBISHI NUCLEAR FUEL CO., LTD.
1
1992
TAKACHIHO ELECTRIC CO., LTD.
1
2007
CANON KABUSHIKI KAISHA
1
1983
NIX, INC.
1
2007
YAMADA CORPORATION
2
2010
Yamada Yuki Seizo Co., Ltd.
2
2
1989
1990
DENSO CORPORATION
2
1
5
1
8
2
4
4
1
4
1997
1998
1999
2000
2001
2003
2004
2005
2006
2007
MITSUBISHI MATERIALS CORPORATION
1
2003
NIPPON SOKEN, INC.
2
2005

Inventor Addresses

AddressDuration
Chuo-ku, JPNov 19, 09 - Nov 19, 09
Ibaraki, JPJun 07, 94 - Jun 07, 94
Kanagawa-ken, JPOct 05, 99 - Dec 31, 02
Kariya, JPDec 07, 99 - Nov 05, 19
Kariya-city, JPOct 04, 01 - Jul 04, 19
Naka-gun, JPFeb 10, 05 - Feb 10, 05
Obu, JPApr 08, 97 - Apr 06, 10
Obu-city, JPSep 04, 03 - Aug 06, 09
Okazaki, JPFeb 20, 07 - Mar 04, 08
Okazaki-city, JPOct 20, 05 - May 31, 07
Oobu, JPJan 30, 07 - Jan 30, 07
Oobu-shi, JPJan 27, 05 - Jan 27, 05
Tokyo, JPMay 08, 90 - Jul 02, 19
Tsukuba, JPSep 11, 12 - Sep 11, 12
Tsukuba-shi, JPJul 08, 10 - Jul 08, 10
Yokohama, JPJun 26, 84 - Jun 26, 84
Yokohama-shi, JPMay 14, 15 - May 14, 15

Technology Profile

Technology Matters
B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 1
B41J: TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS 1
B65D: CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES 4

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Patents / Publication

Patents / Publication #Year of Publication / IssuedTitleCitations
104683222019Semiconductor device capable of suppressing cracks of through-hole protective film and short circuit of adjacent through-electrodes1
2019/0204,1712019PRESSURE SENSOR1
103382152019Measuring point information providing device, change detection device, methods thereof, and recording medium3
102091552019Physical quantity sensing semiconductor device and method for manufacturing the same0
2019/0051,5752019SEMICONDUCTOR DEVICE1

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