Tomoyasu Murakami

Inventor

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Work History

Patent OwnerApplications FiledYear
INTEL CORPORATION
1
1995
RPX CORPORATION
1
1
1993
1994
PANNOVA SEMIC, LLC
1
2
1996
2006
PANASONIC CORPORATION
6
2006
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
1
1
1
2
2
1992
1995
1996
1997
1999
YAZAKI CORPORATION
1
3
4
2
1
1
1
1995
2004
2006
2007
2015
2016
2017

Inventor Addresses

AddressDuration
Hiroshima, JPJan 20, 98 - May 12, 20
Hiroshima-shi, JPSep 14, 06 - Nov 01, 18
Osaka, JPMay 17, 94 - Jul 21, 20
Suita, JPNov 10, 98 - Nov 10, 98

Technology Profile

Technology Matters
B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 3
B24B: MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING 4
B24D: TOOLS FOR GRINDING, BUFFING, OR SHARPENING 1

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Patents / Publication

Patents / Publication #Year of Publication / IssuedTitleCitations
107171432020Vapor-phase type heating method and vapor-phase type heating apparatus0
106516402020Grommet and wire harness using the same0
103052032019Bus bar and method of manufacturing bus bar2
102116132019Protective tube attaching method0
2018/0345,3972018VAPOR-PHASE TYPE HEATING METHOD AND VAPOR-PHASE TYPE HEATING APPARATUS0

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