Koichiro Mukoyama
Inventor
Stats
- 3 US patents issued
- 3 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 3 US Patents Issued
- 3 US Applications Filed
- 26 Total Citation Count
- Jan 17, 1996 Most Recent Filing
- May 15, 1986 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| TANAKA DENSHI KOGYO K.K. | 1
1 1 | 1986
1989 1996 |
Inventor Addresses
| Address | Duration |
|---|---|
| Tokyo, JP | Oct 04, 88 - Dec 30, 97 |
| c/o Tanaka Denshi Kogyo Kabushiki Kaisha, 6-6, Nihonbashi Kayaba-cho,, Chuoh-ku, Tokyo, JP | Jul 03, 90 - Jul 03, 90 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| C22C: | ALLOYS | 3 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 5702814 | 1997 | Gold wire for bonding | 7 |
| 4938923 | 1990 | Gold wire for the bonding of a semiconductor device | 12 |
| 4775512 | 1988 | Gold line for bonding semiconductor element | 5 |
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