Sashidhar Movva
Inventor
Stats
- 2 US patents issued
- 5 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 2 US Patents Issued
- 5 US Applications Filed
- 95 Total Citation Count
- Apr 17, 2014 Most Recent Filing
- Sep 15, 2010 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| QUALCOMM INCORPORATED | 4
2 2 | 2010
2011 2014 |
Inventor Addresses
| Address | Duration |
|---|---|
| San Diego, CA, US | Nov 24, 11 - Aug 06, 15 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| H01L: | SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | 4 |
| H05K: | PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 2015/0221,528 | 2015 | PROCESS FOR IMPROVING PACKAGE WARPAGE AND CONNECTION RELIABILITY THROUGH USE OF A BACKSIDE MOLD CONFIGURATION (BSMC) | 0 |
| 2014/0227,835 | 2014 | PROCESS FOR IMPROVING PACKAGE WARPAGE AND CONNECTION RELIABILITY THROUGH USE OF A BACKSIDE MOLD CONFIGURATION (BSMC) | 0 |
| 8742603 | 2014 | Process for improving package warpage and connection reliability through use of a backside mold configuration (BSMC) | 1 |
| 8703602 | 2014 | Selective seed layer treatment for feature plating | 0 |
| 2012/0139,112 | 2012 | Selective Seed Layer Treatment for Feature Plating | 0 |
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