Terumasa Moriyama
Inventor
Stats
- 4 US patents issued
- 14 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 4 US Patents Issued
- 14 US Applications Filed
- 72 Total Citation Count
- Feb 28, 2018 Most Recent Filing
- May 29, 2009 Earliest Filing
Work History
Patent Owner | Applications Filed | Year |
---|---|---|
JX NIPPON MINING & METALS CORPORATION | 2
3 2 2 5 | 2009
2011 2012 2013 2016 |
Inventor Addresses
Address | Duration |
---|---|
Hitachi-shi, JP | Feb 19, 15 - Feb 19, 15 |
IBARAKI, JP | Dec 22, 16 - Dec 22, 16 |
Ibaraki, JP | Oct 14, 10 - Aug 02, 22 |
Technology Profile
Technology | Matters | |
---|---|---|
B21C: | MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES, PROFILES OR LIKE SEMI-MANUFACTURED PRODUCTS OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL | 2 |
B22F: | WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER | 1 |
B32B: | LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM | 8 |
Patents / Publication
Patents / Publication # | Year of Publication / Issued | Title | Citations |
---|---|---|---|
11401612 | 2022 | Surface-treated copper foil, copper foil having carrier, laminated material, method for producing printed wiring board, and method for producing electronic apparatus | 0 |
2019/0240,729 | 2019 | SURFACE TREATMENT METAL POWDER FOR LASER SINTERING | 1 |
10332756 | 2019 | Carrier-attached copper foil, laminate, method for manufacturing printed-wiring board and method for manufacturing electronic device | 2 |
10123433 | 2018 | Carrier-attached copper foil, laminate, method for manufacturing printed-wiring board and method for manufacturing electronic device | 8 |
2018/0264,783 | 2018 | Metal Foil, Metal Foil Having Release Layer, Laminated Material, Printed Wiring Board, Semiconductor Package, Electronic Device, And Method For Producing Printed Wiring Board | 0 |
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