Terumasa Moriyama

Inventor

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Work History

Patent OwnerApplications FiledYear
JX NIPPON MINING & METALS CORPORATION
2
3
2
2
5
2009
2011
2012
2013
2016

Inventor Addresses

AddressDuration
Hitachi-shi, JPFeb 19, 15 - Feb 19, 15
IBARAKI, JPDec 22, 16 - Dec 22, 16
Ibaraki, JPOct 14, 10 - Aug 02, 22

Technology Profile

Technology Matters
B21C: MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES, PROFILES OR LIKE SEMI-MANUFACTURED PRODUCTS OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL 2
B22F: WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER 1
B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM 8

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Patents / Publication

Patents / Publication #Year of Publication / IssuedTitleCitations
114016122022Surface-treated copper foil, copper foil having carrier, laminated material, method for producing printed wiring board, and method for producing electronic apparatus0
2019/0240,7292019SURFACE TREATMENT METAL POWDER FOR LASER SINTERING1
103327562019Carrier-attached copper foil, laminate, method for manufacturing printed-wiring board and method for manufacturing electronic device2
101234332018Carrier-attached copper foil, laminate, method for manufacturing printed-wiring board and method for manufacturing electronic device8
2018/0264,7832018Metal Foil, Metal Foil Having Release Layer, Laminated Material, Printed Wiring Board, Semiconductor Package, Electronic Device, And Method For Producing Printed Wiring Board0

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